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BREAKDOWN

Latest audio framework support for Qualcomm Gen 4.5 and Gen 5 automotive SOCs. Audio Weaver now supports bare metal chip level integration and direct configuration of TDM and ALSA interfaces as well as multicore audio processing abstraction.
CHALLENGES
  • Complex realtime audio routing across SOCs
  • BSP code revisions to support changes in TDM and ALSA configuration
  • Difficult to tune audio task allocation across multiple cores
  • Early audio difficult to design
SOLUTIONS
  • AWE integrated on all cores using shared memory for synchronization
  • AWE includes new TDM and ALSA modules to support configuration of these devices
  • Multicore and thread management is orchestrated in the AWE layout using specific thread modules. Easy to profile and reassign audio functions across cores and HW threads
  • Core0 AWE integration can support audio frames as small as 250uS
  • Core0 AWE integration can support audio frames as small as 250uS
  • Early audio is built into the boot process
KEY FEATURES
  • Audio Weaver replaces QC Audio Reach framework for more flexible higher performance audio processing
  • Multicore support across all ARM and Hexagon cores
  • Low latency support inherently
  • Easy TDM and ALSA configuration 
  • Early audio access for safety chimes
USE CASES
  • Multichannel (24 speakers) automotive speaker processing
  • Sound Design AVAS and Chime generation
  • Qualcomm voice processing
  • RNC low-latency example
Snapdragon
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