
AUDIO WEAVER ON Snapdragon
AWE-Q Demo
BREAKDOWN
Latest audio framework support for Qualcomm Gen 4.5 and Gen 5 automotive SOCs. Audio Weaver now supports bare metal chip level integration and direct configuration of TDM and ALSA interfaces as well as multicore audio processing abstraction.
CHALLENGES
- Complex realtime audio routing across SOCs
- BSP code revisions to support changes in TDM and ALSA configuration
- Difficult to tune audio task allocation across multiple cores
- Early audio difficult to design
SOLUTIONS
- AWE integrated on all cores using shared memory for synchronization
- AWE includes new TDM and ALSA modules to support configuration of these devices
- Multicore and thread management is orchestrated in the AWE layout using specific thread modules. Easy to profile and reassign audio functions across cores and HW threads
- Core0 AWE integration can support audio frames as small as 250uS
- Core0 AWE integration can support audio frames as small as 250uS
- Early audio is built into the boot process
KEY FEATURES
- Audio Weaver replaces QC Audio Reach framework for more flexible higher performance audio processing
- Multicore support across all ARM and Hexagon cores
- Low latency support inherently
- Easy TDM and ALSA configuration
- Early audio access for safety chimes
USE CASES
- Multichannel (24 speakers) automotive speaker processing
- Sound Design AVAS and Chime generation
- Qualcomm voice processing
- RNC low-latency example




















