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BREAKDOWN

The TI Sitara AM62Dx EVM Multicore Audio Weaver SDK provides a cohesive platform for audio signal chain processing development on TI’s new C7x DSP, powered by a robust and seamless C7x DSP and ARM Cortex-A53 “plug-and-play” multicore integration with DSP Concepts’ embedded and optimized Audio Weaver Core libraries.

KEY FEATURES

  • Highly optimized audio kernels for TI C7x ISA
    • Kernel support for latency critical automotive audio use-cases
  • Multi-Instance audio processing enablement via Audio Weaver
    • Primary processing core: TI C7x DSP
      • ADC/DAC I/O and configuration
    • Secondary processing core: ARM Cortex-A53
    • Simplified inter-processor communication enablement
      • Distribute audio processing across heterogeneous AM62Dx processors within a single unified audio processing signal flow via shared memory
  • Multi-rate and multi-threaded audio processing enablement
    • Mix and match audio data processing transfer rates within a single unified audio processing signal flow
    • Low-latency audio path for latency critical audio requirements and solutionsMulti-rate and multi-threaded audio processing enablement
  • Realtime Embedded Tuning Interface
    • MCU/R5F is tuning gateway
    • Multiple real-time tuning interfaces available via data protocols
      • UART
      • TCP/IP
  • Ethernet Audio Video Bridge (AVB) Support
    • Audio over ethernet per IEEE 1722 protocol
    • Single multichannel PCM audio stream
      • Duplex telephony support
        • 8ch Tx / 8ch Rx

Use Cases

  • In-car communication (ICC)
  • Navigation and safety prompts/chimes
  • Road Noise Cancellation (RNC) / Engine Order Cancellation (EOC)
  • Acoustic Cabin Correction (Entertainment Tunings and Presents)
  • Telephony (Voice Communication)
  • Exterior Sound Enhancement (e.g. Pedestrian warning speaker, exterior voice interaction, etc…)
  • Engine Sound Synthesis (ESS) \ Engine Sound Enhancement (ESE)
  • Acoustic Vehicle Alert System (AVAS)
  • Object-Based Audio (OBA)

HARDWARE AND PROCESSING SPECS

  •  TI C7x DSP
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with ParityQuad ARM Cortex-A53 (1.4GHz)
  • ARM Cortex-M4F (400MHz)
    • 256KB SRAM with SECDED ECC
  • ARM Cortex-R5F
    • Armv7-R architecture
    • R5FSS Memory System
      • 32KB Instruction Cache
        • 4x8KB ways
        • SECDED ECC protected per 64 bits
      • 32KB Data Cache
        • 4x8KB ways
        • SECDED ECC protected per 32 bits
      • 64KB tightly-coupled memory (TCM) per CPU
        • SECDED ECC protected per 32 bits
        • TCM hard error cache Implemented in CPU
        • Readable/writable from system
        • TCMs initialized (to 0's) at reset
        • 32KB TCMA (ATCM)
        • 16KB TCMB0 (B0TCM)
        • 16KB TCMB1 (B1TCM)
    • Full-precision Floating Point (VFPv3)
      16-region Memory Protection Unit (MPU)
    • 8 breakpoints, 8 watch points
    • CoreSight Debug Access Port (DAP)
    • CoreSight ETM-R5 interface (CTI, ETM)
    • Performance Monitoring Unit (PMU)
    • 32-bit to 36-bit Region-based Address Translation (RAT) on memory access initiators
    • Integrated Vectored Interrupt Manager (VIM) per core with 256 Interrupt Inputs each
      • Programmable interrupt priority (4-bit)
      • Programmable interrupt enable mask
      • Software-generated interrupts
      • Synchronous clock domain crossing on all core interfaces

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